Title:
設計支援装置、製造支援装置および情報処理端末
Document Type and Number:
Japanese Patent JP7143788
Kind Code:
B2
Abstract:
The invention provides a comprehensive support method for a wire harness, a comprehensive support system, and a manufacturing support device for the wire harness, which can reduce the difficulty of wiring work of the wire harness and reduce the time required for the work. Comprises: a design support step (S100, S200, S300) in which a wire harness including a plurality of or a single wire laid on a moving body is designed on the basis of three-dimensional (3D) design data for the moving body, and two-dimensional (2D) design data for the designed wire harness is created; manufacturing support steps (S400, S500) in which information indicating a method for manufacturing the wire harness on the basis of the created 2D design data is displayed on the basis of the actual size, and the wire harness is manufactured on the basis of the display; and a wiring support step for displaying, on a portable information processing terminal, wiring process information, which is information relating to a process in which the wiring harness is laid on the moving body, and laying the wiring harness on the moving body by the manufacturing support step (S600) while observing the display.
Inventors:
Kenji Kawase
Aoki Katsuki
Yamamoto Raifu
Namerikawa Masahiko
Aoki Katsuki
Yamamoto Raifu
Namerikawa Masahiko
Application Number:
JP2019043003A
Publication Date:
September 29, 2022
Filing Date:
March 08, 2019
Export Citation:
Assignee:
Hitachi Metals Co., Ltd.
International Classes:
G06F30/18; G06F30/10; H01B13/012
Domestic Patent References:
| JP2003022721A | ||||
| JP2012208903A |
Foreign References:
| WO2017149652A1 | ||||
| US20160225492 |
Attorney, Agent or Firm:
Nagoya International Patent Attorney Corporation
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