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Title:
DESIGN SUPPORT SYSTEM, DESIGN METHOD, DESIGN SUPPORT PROGRAM AND MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JP2007012687
Kind Code:
A
Abstract:

To provide a design support system, a design method, a design support program and a manufacturing method of a semiconductor integrated circuit, with which occurrence of a design pattern that is a main cause of a circuit defect and is difficult to be lithography-processed can be suppressed, dispersion due to manufacture fluctuation is suppressed and yield can be improved.

The system is provided with a data storage device 3 storing information on a defective pattern which is collected through a computer network 9 and is difficult to be lithography-processed, a layout means 10 which defines a plurality of regions in a chip and decides a layout of the chip, a manufacture easiness analysis means 20 reading information of the defective pattern and a decision result of the layout, calculating occurrence frequency of the defective pattern at every region and analyzing manufacture easiness of the layout by occurrence frequency and a layout correcting means 15 which selectively extracts the region whose occurrence frequency is not less than a prescribed value and correcting arrangement of cells and wiring in the region.


Inventors:
UEDA TOSHIAKI
Application Number:
JP2005188379A
Publication Date:
January 18, 2007
Filing Date:
June 28, 2005
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L21/82; G03F1/70; G06F17/50; H01L21/027
Domestic Patent References:
JP2003162041A2003-06-06
JP2005039001A2005-02-10
JP2004191297A2004-07-08
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu