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Title:
卓上切断機
Document Type and Number:
Japanese Patent JP4656376
Kind Code:
B2
Abstract:
A miter saw including a base, a turntable, a support section extending from the turntable, and a circular saw unit supported to the support section and having a circular saw blade. A laser oscillator is disposed at one of the support section and the circular saw unit so as to irradiate a laser line on a surface of the workpiece mounted on the turntable. The laser line on the surface of the work-piece is located within a width defined between loci of opposite side surfaces of the circular saw blade, or immediately beside and along the width. A cut-marking line is drawn on the surface of the workpiece. By adjusting angular rotation of the turntable, the laser line can be aligned with a cut-marking line drawn on a top surface of the work-piece for angled cutting. By adjusting laterally tilting position of the circular saw unit, the laser line can be aligned with a cut-marking line drawn on an approximately vertical surface of the workpiece for slant cutting. An adjustment unit and a tilt amount fine control unit are provided for performing fine control to the rotation angle of the turntable and tilting angle of the circular saw unit, respectively.

Inventors:
Ushiwata Shigeharu
Ryuichi Imamura
Terashima Hideaki
Application Number:
JP2004195001A
Publication Date:
March 23, 2011
Filing Date:
June 30, 2004
Export Citation:
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Assignee:
Hitachi Koki Co., Ltd.
International Classes:
B27B5/20; B23D45/14; B23D47/00; B27B5/29; B27B9/04
Domestic Patent References:
JP2000210901A
JP2004009182A
JP2002254359A
JP2001347501A
JP2000225603A
JP2000158401A
JP2000254817A
JP58084817U
Attorney, Agent or Firm:
Kazuhiro Kitazawa
Shin Koizumi
Akiko Ichikawa



 
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