Title:
取外し可能な相互接続構造体
Document Type and Number:
Japanese Patent JP5420287
Kind Code:
B2
Abstract:
An electronic component includes a base insulative layer (10) having a first surface (12) and a second surface (14); an electronic device (18) having a first surface (20) and a second surface (22); at least one I/O contact (23) located on the first surface of the electronic device; an adhesive layer (16) disposed between the first surface of the electronic device and the second surface of the base insulative layer; a first metal layer (24) disposed on the I/O contact; and a removable layer (26) disposed between the first surface of the electronic device and the second surface of the base insulative layer, and located adjacent to the first metal layer. The base insulative layer (10) secures to the electronic device (18) through the first metal layer (24) and removable layer (26), wherein the first metal layer and removable layer are capable of releasing the base insulative layer from the electronic device (18) when the first metal layer and removable layer (26) are exposed to a temperature higher than their softening points or melting points.
Inventors:
Charles Gerald Woichk
Raymond Albert Fillion
Raymond Albert Fillion
Application Number:
JP2009075413A
Publication Date:
February 19, 2014
Filing Date:
March 26, 2009
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
H01L23/12; H05K3/32
Domestic Patent References:
| JP2006100457A | ||||
| JP2002057453A |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Hirokazu Ogura
Toshihisa Kurokawa