DEVELOPER FOR PHOTOSENSITIVE POLYIMIDE, METHOD FOR FORMATION OF POLYIMIDE FILM PATTERN, AND ELECTRONIC PARTS

Japanese Patent JP3677191

B2

PROBLEM TO BE SOLVED: To significantly improve the resolution characteristics and film remaining characteristics of a photosensitive polyimide by preparing a developer from a soln. of an amine compd. having a specified range of the base dissociation exponent pKb in an aq. soln. at specified temp.
SOLUTION: The developer consists of an aq. soln. of an amine compd. having 5 to 8 base dissociation exponent pKb in an aq. soln. at 25°C. In the production of a polyimide film pattern, a positive photosensitive polyimide soln. containing a polyimide precursor and a photosensitive dissolution preventing agent is applied on the surface of a substrate, heated to form a resin layer and exposed in a desired region of the resin layer. The resin layer after exposed is developed with a developer consisting of an aq. soln. of an amine compd. having 5 to 8 base dissociation exponent pKb in an aq. soln. at 25°C, and then the resin layer after developed is heat treated. The polyimide precursor is preferably a polyamide acid having the recurring unit expressed by the formula. In the formula, each &phiv and Ψ is a subtd. or unsubtd. 1-30C aliphatic hydrocarbon group or the like, and m is a positive integer.

Kawamonzen Yoshihiro
Rumiko Hayase
Shigeru Matake
Satoshi Mikoshiba

JP2000066836A

July 27, 2005

March 10, 2000

Click for automatic bibliography generation  

Toshiba Corporation

C08G73/10; C08K5/28; C08L79/08; G03F7/004; G03F7/022; G03F7/023; G03F7/037; G03F7/32; G03F7/40; H01L21/027; (IPC1-7): G03F7/32; G03F7/037; H01L21/027

JP11065119A
JP52013315A
JP10333332A
JP10083086A
JP10083085A

Takehiko Suzue
Sadao Muramatsu
Atsushi Tsuboi
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai

Previous Patent: CLUTCH MECHANISM FOR DRIVER DRILL

Next Patent: IMAGE PROCESSOR