Title:
DEVELOPING METHOD AND DEVELOPER COATING APPARATUS
Document Type and Number:
Japanese Patent JP3869306
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a developing method which can be used according to characteristics of a developer of a resist material and can improve CD uniformity, and also to provide a developer coating apparatus which uses the developing method.
SOLUTION: In developing a wafer having a resist film formed thereon with a fast dissolving rate to a developer and subjected to light exposure, the wafer is first held in a spin chuck (step 11), the developer having a low concentration is mounted on the wafer (step 12), and the wafer is allowed for a predetermined time to advance a developing reaction (step 13). Subsequently, another developer having a concentration higher than the developer used in the step 12 is applied on the wafer (step 14), the wafer is allowed for a predetermined time (step 15), and then the wafer is rinsed (step 16). In this manner, the uniformity of line widths at the center and peripheral edge of the wafer can be improved.
Inventors:
Kosuke Yoshihara
Keiichi Tanaka
Taro Yamamoto
Hideharu Kyoda
Hiroshi Takeguchi
Atsushi Okochi
Keiichi Tanaka
Taro Yamamoto
Hideharu Kyoda
Hiroshi Takeguchi
Atsushi Okochi
Application Number:
JP2002146594A
Publication Date:
January 17, 2007
Filing Date:
May 21, 2002
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; G03D3/06; G03F7/30; H01L21/00; (IPC1-7): H01L21/027; G03F7/30
Domestic Patent References:
| JP4338960A | ||||
| JP2000315643A | ||||
| JP7161621A | ||||
| JP5283332A | ||||
| JP1278022A | ||||
| JP2001102292A | ||||
| JP2000340495A | ||||
| JP11260707A | ||||
| JP11074195A |
Attorney, Agent or Firm:
Hiroshi Takayama