Title:
動的熱特性評価を用いたジャンクション温度セッティング半導体素子の信頼性試験装置および方法
Document Type and Number:
Japanese Patent JP7291818
Kind Code:
B2
Abstract:
To provide reliability test device and method that, in a reliable test for a semiconductor element with junction temperature set, can increase the accuracy of the reliability test of the semiconductor element using a dynamic heat characteristic evaluation.SOLUTION: The junction temperature necessary for a reliability test for a semiconductor element is set, and the board temperature of a package board 20 is maintained according to the set junction temperature. Driving current is applied and during the reliability test, when the driving current is switched to sensing current, the change quantity of output voltage output from a semiconductor element 10 is calculated, and thus, the junction temperature of the semiconductor element 10 is calculated. The board temperature is adjusted so that the calculated junction temperature is changed to the set junction temperature.SELECTED DRAWING: Figure 2
Inventors:
Ma Byun Jin
Application Number:
JP2022017068A
Publication Date:
June 15, 2023
Filing Date:
February 07, 2022
Export Citation:
Assignee:
Korea Electronics Technology Institute
International Classes:
G01R31/26
Domestic Patent References:
| JP2008008677A | ||||
| JP9304471A | ||||
| JP2000039461A | ||||
| JP2017032303A | ||||
| JP5029417A | ||||
| JP2014105996A | ||||
| JP2007315906A |
Foreign References:
| KR101869804B1 | ||||
| WO2005011006A1 | ||||
| US6203191 | ||||
| US20190383670 | ||||
| CN211785909U |
Attorney, Agent or Firm:
▲吉▼川 俊雄
Hiroshi Ichikawa
Hiroshi Ichikawa