Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DEVICE FOR ASSEMBLING ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPS60197325
Kind Code:
A
Abstract:

PURPOSE: To make it possible to assemble various kinds of electronic parts with the use of only one assembling device, by providing such an arrangement that an electronic part is aligned with a bolt fastening position while leaving a torque motor section stationary, and spline shafts are connected between universal joints to freely move the nut sections of the spline shafts.

CONSTITUTION: Each set of flexible joints 8 which are secured respectively to a chuck section 17 and a constant torque motor section 6, are connected together by means of a spline shaft 10 and a spline housing 9. When a positioning guide section 14 is raised so that a tapered section 20 is aligned with the tapered section of a jig 4, and therefore, an electronic part is positioned at the center of the device. The position of each bolt 3 for the electronic part is detected by a sensor delivering a position signal by which a drive motor 12 in a movable section 16 is driven in association with constant pulses so that the chuck section 17 moves a side guide 11 to be aligned with the bolt 3, and the electronic part is raised by means of a guide 14 so that the bolt 3 is engaged with the chuck section 17 to be stopped by a stopper 18, thereby the bolt 3 may be fastened by a motor 6.


Inventors:
SHIMIZU ISAMU
SUZUKI MASARU
SASA HARUO
NAKAGAWA MASARU
Application Number:
JP5218084A
Publication Date:
October 05, 1985
Filing Date:
March 21, 1984
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI LTD
International Classes:
B23P19/06; H05K13/04; (IPC1-7): H05K13/06
Attorney, Agent or Firm:
Akio Takahashi