Title:
DEVICE FOR BUILDING CUTOFF FILM AND BUILDING METHOD USING SAME
Document Type and Number:
Japanese Patent JP2516552
Kind Code:
B
Abstract:
PURPOSE: To install cutoff films in the ground in such a way that they are held in a predetermined expanded state and overlap one another.
CONSTITUTION: A building frame 20 has an expansion frame 22 on each side of a cutoff-film extending frame 21, the expansion frame 22 being freely moved sidewards by expansion cylinders 24, 24.... A unit cutoff film to be built is extended with both of its side edges folded to one side of the cutoff-film extending frame 21, and is inserted and installed, together with a cutoff-film building device, as excavation is carried out. Next, after the overall length of the folded portion of the cutoff film extended has been expanded sidewards by moving the expansion frame 22 sidewards, the building frame 20 is removed.
Inventors:
Senda, Shohei
Miyazaki, Yasuo
Jinnai, Naoki
Inagawa, Koichi
Ikuhara, Osamu
Deguchi, Toshihiro
Yamaguchi, Masatsugu
Onomi, Hiroaki
Kurosawa, Masayuki
Miyazaki, Yasuo
Jinnai, Naoki
Inagawa, Koichi
Ikuhara, Osamu
Deguchi, Toshihiro
Yamaguchi, Masatsugu
Onomi, Hiroaki
Kurosawa, Masayuki
Application Number:
JP1993000124074
Publication Date:
April 30, 1996
Filing Date:
May 26, 1993
Export Citation:
Assignee:
Doboku, Kenkyu Center
OSAKA BOSUI CONSTR CO LTD
SANSHIN KENSETSU KOGYO KK
NITTOC CONSTR CO LTD
HIROSE & CO LTD
FUDO GIKEN KK
RAITO KOGYO CO LTD
MITSUBISHI CONSTR CO LTD
KUROSAWA JIOMETSUKU:KK
OSAKA BOSUI CONSTR CO LTD
SANSHIN KENSETSU KOGYO KK
NITTOC CONSTR CO LTD
HIROSE & CO LTD
FUDO GIKEN KK
RAITO KOGYO CO LTD
MITSUBISHI CONSTR CO LTD
KUROSAWA JIOMETSUKU:KK
International Classes:
E02D19/12; E02D5/18; E02D5/20; E02D19/04; E02D19/00; E02D5/00; E02D5/18; (IPC1-7): E02D19/12; E02D5/18; E02D19/04
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