Title:
粒状要素を封じ込めるためのデバイス
Document Type and Number:
Japanese Patent JP7462627
Kind Code:
B2
Abstract:
Disclosed is a device for containing granular elements, comprising a metal mesh panel having metal wires welded together, the panel comprising at least one curvature of a first orientation and at least one curvature of a second orientation, the first orientation being characterized by a first axis and the second orientation being characterized by a second axis, the first axis and the second axis being non-collinear.
Inventors:
Yashin Benani Braouri
Nikola Freitag
Nikola Freitag
Application Number:
JP2021524436A
Publication Date:
April 05, 2024
Filing Date:
November 08, 2019
Export Citation:
Assignee:
SOLETANCHE FREYSSINET
International Classes:
E02D29/02; E01F7/04; E02D17/20
Domestic Patent References:
| JP2004143774A | ||||
| JP7099022B2 | ||||
| JP2015010421A | ||||
| JP2004300701A | ||||
| JP2007126864A | ||||
| JP2015036502A | ||||
| JP8232267A |
Foreign References:
| US8967917 | ||||
| US5733072 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe
Previous Patent: High-density carbon film for patterning applications
Next Patent: Manual method for injection molding of coated parts
Next Patent: Manual method for injection molding of coated parts