Title:
DEVICE FOR CUTTING BELTLIKE OLDER
Document Type and Number:
Japanese Patent JPH06210446
Kind Code:
A
Abstract:
PURPOSE: To obtain a plate solder which is capable of being used in a semiconductor for an electric power by cutting a belt like solder wound on a reel.
CONSTITUTION: In a device for making a plate solder by inserting a beltlike solder 3 from an outside, inserting through a motor and cutting the beltlike solder with an upper tooth 11 and a lower tooth 12, the beltlike solder is cut by fixing the upper tooth 11 and moving the lower die. Then, a taper 11b having 50-70 degrees in a thickness direction is provided on the upper tooth.
Inventors:
ARAKI TAKUMI
NAKATANI MASAO
NAKATANI MASAO
Application Number:
JP2364793A
Publication Date:
August 02, 1994
Filing Date:
January 18, 1993
Export Citation:
Assignee:
SANSHA ELECTRIC MFG CO LTD
International Classes:
B23K1/00; B23K3/06; (IPC1-7): B23K3/06; B23K1/00
Domestic Patent References:
| JPS5954462A | 1984-03-29 | |||
| JP60130637B | ||||
| JP59065532B |
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