Title:
装置及び装置の製造方法
Document Type and Number:
Japanese Patent JP2024508247
Kind Code:
A
Abstract:
本発明は、はんだ接続部（５）により圧電素子（２）が固着された振動体（１）を有する装置に関する。本発明は、さらに、装置の製造方法に関する。【選択図】図１
Inventors:
Warnefer, Wolfgang
Rajapurkar, Aditya
Tourel, Gert
Mijocevic, Zdravko
Pentshell-Stani, Andreas
Rajapurkar, Aditya
Tourel, Gert
Mijocevic, Zdravko
Pentshell-Stani, Andreas
Application Number:
JP2023548331A
Publication Date:
February 26, 2024
Filing Date:
February 01, 2022
Export Citation:
Assignee:
TDK ELECTRONICS AG
International Classes:
G06F3/041; B06B1/06; H10N30/06; H10N30/20; H10N30/853; H10N30/87
Attorney, Agent or Firm:
Maeda Suzuki International Patent Attorneys Corporation
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