Title:
粉末によってまたは混合粉末によってモールドを充填するためのデバイス
Document Type and Number:
Japanese Patent JP4727588
Kind Code:
B2
Abstract:
A device for filling at least one mold with at least one powder. The device includes a mechanism to add at least one powder, at least one mechanism to eject the powder added into the device, in the form of a layer, and at least one deflector capable of locally intercepting at least part of the powder ejected in the form of a layer and redirecting the locally intercepted powder towards a determined location in the mold.
Inventors:
Stefan Revol
Application Number:
JP2006540563A
Publication Date:
July 20, 2011
Filing Date:
November 25, 2004
Export Citation:
Assignee:
INSERM(INSTITUT NATIONAL DE LA SANTE ET DE LA RECHERCHE MEDICALE)
Federal Mogul Operation France S.A.S.
Federal Mogul Operation France S.A.S.
International Classes:
B28B3/02; B22F3/00; B22F3/035; B28B13/02; B30B15/30
Domestic Patent References:
| JP2000119704A |
Foreign References:
| DE2450736C2 | ||||
| FR2234045A1 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro