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Title:
DEVICE FOR FORMING LEAD-OUT PART OF WIRING AND PIPING MATERIALS
Document Type and Number:
Japanese Patent JP2012077812
Kind Code:
A
Abstract:

To provide a lead-out part formation device for wiring and piping materials which can use and attach one type of a terminal protection member to both of a connection port of a connection body attached to a wall hole and a lead-out opening of a long protector to form a lead-out part which protects wiring and piping materials.

The device includes cylindrical long protectors 51 and 52 which each house a cable, a connection body 11 which includes a connection port 12 to which one end part of the long protector is connected and houses the cable, and a cylindrical bushing 31 which is attached to the connection port 12 of the connection body 11. The connection port 12 of the connection body 11 has an inner surface along the outer wall surface of the long protector. The bushing 31 includes a connection port-attached part 32 attached to the connection port 12 of the connection body 11, a cable lead-out port formation part 33, and an insertion part 34 which can be inserted in the long protector, whereby there are formed the lead-out part of the cable which is led out of the connection body 11 and the lead-out part of the cable which is led out of the other end part of the long protector.


Inventors:
NAKAMURA ATSUSHI
Application Number:
JP2010222166A
Publication Date:
April 19, 2012
Filing Date:
September 30, 2010
Export Citation:
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Assignee:
MIRAI IND
International Classes:
F16L5/00; H02G3/02; H02G3/04
Domestic Patent References:
JP2009240115A2009-10-15
JPS62146096U1987-09-14
JPH0393330U1991-09-24
JPH0949645A1997-02-18
JP2009150433A2009-07-09
Attorney, Agent or Firm:
Kenichi Uno