Title:
DEVICE FOR FORMING MOLD
Document Type and Number:
Japanese Patent JPS5562744
Kind Code:
A
Abstract:
PURPOSE:To increase the processing capacity of a device for forming a mold while simplifying the device by arranging an intermediate mold between the cope and the drag, inserting lead frames into the front and the back of the intermediate mold for tightening the cope and the drag, and injecting resin thereinto. CONSTITUTION:A molding unit consists of a cope 11 having a cope functioning unit 2 on the lower surface and a drag 12 having a drag functioning unit 3 on the upper surface. A movable platen 1 mounted on the lower surface of the drag 12 is drawn down to thereby sufficiently expand the gap between the functioning units 2 and 3 to thus pull out an intermediate mold 4 arranged therebetween. Lower and upper functioning units 5 and 6 cut with grooves 10 for sealing semiconductor pieces on the lead frames are provided on both front and back surfaces of the mold 4, the lead frames are secured to both the front and the rear surfaces of the mold 4, and are returned between the molds 11 and 12. Then, the platen 1 is pushed up, the frames are contacted therebetween to feed the resin from a resin injecting cylinder 8 through an inlet 7 into the grooves 10 of the frames and to seal the resin on the semiconductor piece.
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Inventors:
NISHIMURA KATSUHIRO
Application Number:
JP13503778A
Publication Date:
May 12, 1980
Filing Date:
November 01, 1978
Export Citation:
Assignee:
KYUSHU NIPPON ELECTRIC
International Classes:
H01L21/56; B29C43/00; B29C45/00; B29C45/02; B29C45/14; B29C45/26; (IPC1-7): B29G3/00; H01L21/56
Domestic Patent References:
| JPS50109255A | 1975-08-28 |