To enhance reliability in inspection by measurement of electrostatic capacity.

This circuit board inspecting device 1, where contact type probes 3, 4 are provided to make contact with the conductor patterns of a circuit board P, where the probes 3, 4 are brought into contact with the conductor patterns insulated each other for measuring the electrostatic capacity between the each conductor pattern and a reference electrode 2b, and where the quality of the conductor pattern is inspected, based on the measured electrostatic capacity is provided with a measuring part 6 for supplying an alternating signal for the inspection between the probes 3, 4 under the condition that they are brought into contact respectively with the respective conductor patterns, and for measuring, under this condition, a measuring parameter, specified based on at least one out of a current value of a current flowing between the probes 3, 4, the voltage value of the alternating signal, and the phase difference between a voltage phase of the signal and a current phase thereof, and a determining part 8 for comparing the parameter with a reference value, to determine the contact condition of the probes 3, 4 to the conductor patterns.