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Patent Searching and Data


Title:
DEVICE FOR INSPECTING SUBSTRATE
Document Type and Number:
Japanese Patent JP2004286669
Kind Code:
A
Abstract:

To provide the device for inspecting a substrate which enables sure prevention of the occurrence of poor contact, by securing the contact pressure between the electrode on the substrate and the contact probe.

The device for inspecting substrate 1 is equipped with a contact probe 54 contacted and conducted to the electrode of a substrate W, an inspection measurement circuit 55 to measure the electrical characteristics of the substrate W via this contact probe 54, a pin board 56 to set up the contact probe 54, and the drive mechanisms 57, 58 to actuate this pin board 56, in order to contact the contact probes 54 to the electrode. In addition, it is also provided with pins 2, arranged on the pin board 56 which are for the contact state detection to the electrode, the contact detector 3 to detect the quality of the contact state between these pins 2 used for the contact state detection and the electrode, and the position control circuit 4 to actuate drive mechanisms 57, 58 at imperfect contact so as to correct the position of the pin board 56.


Inventors:
MITANI TAKAAKI
Application Number:
JP2003080952A
Publication Date:
October 14, 2004
Filing Date:
March 24, 2003
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
G01R31/28; H05K3/00; G01R1/06; (IPC1-7): G01R31/28; G01R1/06; H05K3/00