Title:
DEVICE FOR MANUFACTURE OF STAMPING PLATE
Document Type and Number:
Japanese Patent JP3885277
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a stamping plate manufacturing device which is capable of manufacturing a stamping plate structured to be seepage-proof against a stamp ink oozing out of the surroundings of a stamped image.
SOLUTION: A base material 12 for a stamp is laminated in the recessed part 24 of a tray 2 and is compressed between the recessed part 24 and the lower face of a pressing part 25. At the same time, the edge parts (e) of the base material 12 are pressed by the projecting part 30 of the pressing part 25 and then are deformed under the effect of a given higher compression level than the non-edge part (f). Next, the tray 2 is introduced into a unit body and a flash bulb 6 is caused to light up through a switching device. Consequently, an infrared beam R2 is emitted to the corresponding part of the base material 12 to the part other than the non-light permeable part 11c of the copy sheet 11, so that the part as described melts to be set and a non-ink seepage part 12b of a melt thickness 11 is formed in the edge parts E of the base material 12 for a stamp. At the same time, the non-ink seepage part 12b of a melt thickness 11 is formed in the non-edge part F of the base material 12 to obtain a stamping plate 14.
Inventors:
Keiji Seo
Application Number:
JP9538797A
Publication Date:
February 21, 2007
Filing Date:
April 14, 1997
Export Citation:
Assignee:
Brother Industries, Ltd.
International Classes:
B41K1/50; B41C1/055; B41D7/00; (IPC1-7): B41D7/00; B41K1/50
Attorney, Agent or Firm:
Naohisa Kaneko
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