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Title:
WIRING/PIPING DEVICE, WIRING/PIPING MATERIAL INSTALLATION STRUCTURE, AND INSTALLATION METHOD OF PIPE CONNECTION BODY AND HEAT INSULATION MATERIAL FOR DISPOSING WIRING/PIPING MATERIAL
Document Type and Number:
Japanese Patent JP2013209844
Kind Code:
A
Abstract:

To provide a wiring/piping device and a wiring/piping material installation structure enabling local deterioration of heat insulation performance to be reduced and wiring/piping materials to be disposed inside and outside a wall, without extending a wiring/piping space.

In a wiring/piping device (100) and a wiring/piping material installation structure (10), a wiring/piping material is inserted through a through-hole formed penetrating between the inside and the outside of a wall (20). The device (100) is provided with a body part (111) installed on the inside of the wall and a drawer part (113) disposed from the body part (111) to the through-hole (21), and comprises: a hollow pipe connection body (110) of which one portion in its whole shape is bent or curved; and a heat insulation spacer (120) having heat insulating property interposed between a part or the whole of a portion of the pipe connection body (110), bent or curved and facing the wall, and the inner surface (20a) of the wall(20).


Inventors:
NAKAMURA ATSUSHI
Application Number:
JP2012080954A
Publication Date:
October 10, 2013
Filing Date:
March 30, 2012
Export Citation:
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Assignee:
MIRAI IND
International Classes:
E04B1/76; F16L5/00
Domestic Patent References:
JP2009240115A2009-10-15
JP2010060054A2010-03-18
JP2002228049A2002-08-14
JP2011185354A2011-09-22
JPH06463U1994-01-11
JPS5667839U1981-06-05
JP2008149260A2008-07-03
JPH03104365U1991-10-29
Attorney, Agent or Firm:
Hiroe Associates Patent Office



 
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