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Title:
DEVICE FOR MEASURING MATERIAL THICKNESS
Document Type and Number:
Japanese Patent JP2013156246
Kind Code:
A
Abstract:

To provide a piezoelectric sensing device for measuring material thickness of targets such as pipes, tubes and other conduits that carry fluids.

A piezoelectric sensing device 100 comprises a substrate 102 and a piezoelectric element 104 with a ceramic body 106. The ceramic body 106 is configured with an electrode 108, a ground 110, and a wrap tab 112 constructed of gold plating or comparable conductive material that is deposited on the ceramic body 106. The substrate 102 comprises a flexible circuit material 114 provided with a first layer 116, a second layer 118, and a receiving area 120 that is configured to receive the piezoelectric element 104.


Inventors:
FRED TIMOTHY MATTHEWS
PAUL ALOYSIUS MEYER
MATTHEW HARVEY KROHN
NATHAN JOHN SMITH
ADEODATO MARIA VIGANO
Application Number:
JP2012270875A
Publication Date:
August 15, 2013
Filing Date:
December 12, 2012
Export Citation:
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Assignee:
GEN ELECTRIC
International Classes:
G01B17/02; G01N29/04; G01N29/24; H04R17/00
Domestic Patent References:
JP2009080090A2009-04-16
JPH11318891A1999-11-24
JPH02207000A1990-08-16
JPH05235515A1993-09-10
JP2010528566A2010-08-19
Foreign References:
US20080202664A12008-08-28
US20060154398A12006-07-13
WO2006033346A22006-03-30
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka