Title:
DEVICE FOR AND METHOD OF APPLYING CREAMY SOLDER
Document Type and Number:
Japanese Patent JPH04344242
Kind Code:
A
Abstract:
PURPOSE: To obtain a uniform transfer quality of creamy solder.
CONSTITUTION: A device for applying creamy solder transfers creamy solder 30 onto a PCB(printed circuit board) through holes 1-1 to 1-4 provided in a plate-like metal mask 1. This device has a structure that the creamy solder 30 is cast into the holes 1-1 to 1-4 by sliding a pair of skimmers made of a rubber member toward one direction of F3 (F1) under the condition where the skimmers abut in parallel against the metal mask 1, and that the creamy solder 30 cast into the holes 1-1 to 1-4 of the metal mask 1 is transferred onto the PCB, which is not illustrated herein, by air pressure.
Inventors:
ISHII HIROSHIGE
Application Number:
JP11712391A
Publication Date:
November 30, 1992
Filing Date:
May 22, 1991
Export Citation:
Assignee:
EICOM CORP
International Classes:
B23K3/06; B41F15/08; B41F16/00; H05K3/34; H05K3/12; (IPC1-7): B23K3/06; B41F15/08; B41F16/00; H05K3/34
Attorney, Agent or Firm:
Yasunori Otsuka (1 person outside)
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