Title:
DEVICE AND METHOD FOR CHEMICAL-MECHANICAL POLISHING (CMP)
Document Type and Number:
Japanese Patent JP3761311
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a scratch from generating at the surface of a semiconductor substrate by removing particles and massive polishing particles remaining on a polishing pad or an auxiliary pad effectively using a polishing pad brush.
SOLUTION: In order to remove particles and massive polishing particles existing on a polishing pad 120a after a conditioning stage, the surface of the polishing pad 120a is brushed by a polishing pad brush 170. At this time, by proceeding a brushing stage while the polishing pad brush 170 is brought into close contact with the polishing pad 120a when the polishing pad brush 170 is transferred from the central part to the edge part of the polishing pad 120a, and while the polishing pad brush 170 is separated from the polishing pad 120a when the polishing pad brush 170 is transferred from the edge part to the central part of the polishing pad 120a, it is possible to increase brushing efficiency. By supplying cleaning liquid to the surface of the polishing pad 120a, it is also possible to increase brushing efficiency.
Inventors:
Tora
Application Number:
JP33463797A
Publication Date:
March 29, 2006
Filing Date:
December 04, 1997
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
B24B53/007; B24B53/017; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Domestic Patent References:
| JP8243914A | ||||
| JP5939163U | ||||
| JP5981054A | ||||
| JP8153694A | ||||
| JP79340A | ||||
| JP8243915A | ||||
| JP7321076A |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Takashi Watanabe
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