Title:
DEVICE AND METHOD FOR CLEANING SUBSTRATE
Document Type and Number:
Japanese Patent JP3426560
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a device and a method for cleaning a substrate, by which the substrate such as a semiconductor material, ULSI and a wafer can be cleaned with high cleaning effectiveness.
SOLUTION: This substrate cleaning device has a substrate cleaning section 5 for cleaning the substrate being a subject to be cleaned by the action of a cleaning liquid on the substrate surface by jetting the cleaning liquid from a supersonic nozzle for generating a supersonic current while accelerating the speed of the cleaning liquid into supersonic one by a compressed gas and an ultraviolet irradiation section 7 for irradiating the substrate, just before or/and just after it is cleaned with the cleaning liquid, with ultraviolet rays in the atmosphere.
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Inventors:
Naoya Hirano
Eiichi Hoshino
Hiroma Hoko
Taro Ogawa
Eiichi Hoshino
Hiroma Hoko
Taro Ogawa
Application Number:
JP2000109852A
Publication Date:
July 14, 2003
Filing Date:
April 11, 2000
Export Citation:
Assignee:
島田理化工業株式会社
富士通株式会社
株式会社日立製作所
富士通株式会社
株式会社日立製作所
International Classes:
B08B3/02; B08B3/10; G03F1/82; H01L21/304; (IPC1-7): B08B3/10; B08B3/02; G03F1/08; H01L21/304
Domestic Patent References:
JP200031239A | ||||
JP8318181A | ||||
JP200070885A |
Attorney, Agent or Firm:
Makoto Hagiwara
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