Title:
DEVICE AND METHOD FOR CUTTING OFF WORKPIECE
Document Type and Number:
Japanese Patent JPH10286800
Kind Code:
A
Abstract:
To easily and surely cut off a workpiece from a material regardless of weight by use of a small-sized and calm device.
An uncut part 13 is cut by moving a workpiece 12 as it is held on both sides by holding bodies 20, 25 on one side and on the other side to move to one side (lower side), so it can be surely cut of even when weight of the workpiece 12 is small. Since vibration is not used for cutting it off, a compact device is sufficient, almost no noise is generated during cutting work, and separation work is not required because the workpiece 12 is parted from a material 11 when it is cut off.
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Inventors:
KANEKO NORIYUKI
MURAYAMA HIDEKAZU
MURAYAMA HIDEKAZU
Application Number:
JP10816497A
Publication Date:
October 27, 1998
Filing Date:
April 10, 1997
Export Citation:
Assignee:
BRIDGESTONE CORP
International Classes:
B26F3/02; (IPC1-7): B26F3/02
Attorney, Agent or Firm:
Toshio Tada