To eliminate any wasteful use of an embossed tape, to improve the rate of operation, and to omit a re-winding step after checking the appearance.

A tape cutting device for holding electronic components in which a cover tape 3 is heat-bonded to the embossed tape 2 with a plurality of pockets 5 for holding electronic components and a plurality of guide holes formed along the longitudinal direction to the predetermined position so as to cover the pockets 5, the integrated embossed tape 2 and the cover tape 3 are wound around a reel 7, and the tape on the final end side is cut, comprises a sucking means 16 which sucks the cover tape 3 on the final end side and peels it from an embossed tape 2, and a cutter which cuts the embossed tape 2 at the position where the cover tape 3 is sucked, and cuts the cover tape 3 which is wound to the required length of the leader part after releasing the suction of the cover tape at the same position, and the cover tape 3 is left to be longer by the required length of the leader part than the embossed tape 2.