PURPOSE: To provide the title device and method for depositing high quality film at a high deposition rate causing less adherence of a film to the inner surface of a film formation chamber.

CONSTITUTION: The title deposited film formation device wherein a film formation space 106 is evacuated by an exhaust system and reactive gas and microwave energy are introduced into the film formation space 106 to form a deposited film on a substrate 105 by the glow discharge excited by the introduced microwave energy is composed of a double-structure wall of the film formation chamber 101 comprising electrically insulated inner wall 109 and outer wall 110, and a means impressing the inner wall of the film formation chamber 101 with a voltage.