Title:
DEVICE AND METHOD FOR DEVELOPMENT
Document Type and Number:
Japanese Patent JP3180209
Kind Code:
B2
Abstract:
PURPOSE: To prevent a substrate to be processed from being damaged so as to improve the quality of a developing process by moderating the impact given to the substrate from a developing solution supplied to the surface of the substrate from a nozzle.
CONSTITUTION: A developing solution supplying nozzle 70 is made to start the discharging of a developing solution at a position (first position) just in front of the nozzle 70 reaches the edge of a semiconductor wafer W while the nozzle 70 is moved to a position above the water W. Consequently, the developing solution forcibly discharged from the nozzle 70 at starting the discharge or immediately after the discharge does not hit the water W, but directly drops into a cup P. The nozzle 70 is then moved above the water W which is rotated at a prescribed rotating speed while the nozzle 70 discharges the developing solution in stable discharge flow through each discharge opening 80 and stops at a prescribed second position. Even at the second position, the nozzle 70 continuously discharges the developing solution for a prescribed period of time. As a result, the developing solution is amassed on the surface of the water W.
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Inventors:
Hirokazu Inada
Kunie Tsunematsu
Kunie Tsunematsu
Application Number:
JP27698495A
Publication Date:
June 25, 2001
Filing Date:
September 29, 1995
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G03F7/16; B05C11/08; B05C11/10; G03F7/30; H01L21/027; (IPC1-7): H01L21/027; B05C11/08; G03F7/16
Attorney, Agent or Firm:
Masataka Sasaki