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Patent Searching and Data


Title:
DEVICE AND METHOD FOR DRYING SUBSTRATE
Document Type and Number:
Japanese Patent JPS62293723
Kind Code:
A
Abstract:

PURPOSE: To enable drying, in which fine particles do not adhere, by introducing a heated liquid into a washing tank, forming a low temperature region lower than a liquid temperature in a predetermined region on a level and shaping a high temperature region higher than the liquid temperature in a region on the low temperature region.

CONSTITUTION: Ultra-pure water 11 is heated at 90W100° by a heater 13. Cooling water is caused to flow into a coil for cooling so that 60W80°C lower than ultra-pure water ll is obtained at a distance x up to the end of the coil for cooling from the surface of ultra-pure water 11 and a low temperature region 16 is formed, and a high temperature region 17 at 110W150°C is shaped onto the low temperature region 16 by a heater 15. An silicon substrate 12 completely washed by water is held in the low temperature region 16 and washed by steam, and a liquid adhering on the substrate 12 is evaporated and dried in the high temperature region 17. Accordingly, dust does not adhere on the substrate and the substrate can be dried. Washing and drying processes are automated easily.


Inventors:
YONEDA TADANAKA
Application Number:
JP13850586A
Publication Date:
December 21, 1987
Filing Date:
June 13, 1986
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
F26B3/00; H01L21/304; (IPC1-7): F26B3/00; H01L21/304
Attorney, Agent or Firm:
Toshio Nakao