Title:
DEVICE AND METHOD FOR EXTRACTING FLEXIBLE TABULAR BODY
Document Type and Number:
Japanese Patent JP3859481
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a device and method for extracting flexible tabular bodies such as wafers one by one with high reliability without damaging them.
SOLUTION: The extracting device has a fixing pad 14 for fixing the topmost wafer 12a by pressing a part thereof, sucking pads 13 for sucking and lifting other parts of the wafer 12a, and sliding elements 16 that slide down on the lifted end faces of the wafer 12a. When roughly rectangular wafers 12 are to be extracted out of the stack one by one, the fixing pad 14 presses and fixes a part of the topmost wafer 12a, the sucking pads 13 suck and lift other parts of the wafer 12a for it to be bent, and the sliding elements 16 slide down on the lifted end faces. This separates the wafer 12b from the wafer 12a, and the wafer 12a is pulled up and extracted.
Inventors:
Matsui Miwa
Yoshikazu Kawagoe
Yoshikazu Kawagoe
Application Number:
JP2001319501A
Publication Date:
December 20, 2006
Filing Date:
October 17, 2001
Export Citation:
Assignee:
Sharp Corporation
International Classes:
B65H3/08; B65H7/12; B65H3/54; B65H3/56; H01L21/677; H01L21/68; (IPC1-7): B65H3/08; B65H3/54; B65H3/56; B65H7/12; //H01L21/68
Domestic Patent References:
| JP7009269A | ||||
| JP8026514A | ||||
| JP6179535A | ||||
| JP2001114434A |
Attorney, Agent or Firm:
Keiichiro Saikyo