To provide a device and a method for film formation by which an abnormal discharging does not occur and a formed film is not destroyed when laminating a metal film and a dielectric film on an insulated substrate at least.
This device has first sputter chambers CH1 and CH3 each equipped with a target 91 for forming the metal film, an electrode 92 for holding the target 91 and a DC power source 65, second sputter chambers CH2, CH4 and CH5 each equipped with a target 91 for forming the dielectric film, an electrode 92 for holding the target 91 and an RF power source 60 for impressing a high frequency voltage to the electrode 92, a carrier 6 for holding a substrate 52 and a conveyer 3 for holding the carrier 6 while electrically floating it and for conveying the carrier 6 between the first and second sputter chambers, and the films are formed by grounding the carriers 6 positioned in the second sputter chambers CH2, CH4 and CH5.
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IKEDA ETSURO
FURUICHI NOBUAKI
