To provide a device and method for heat-treating substrate, by which heat treatment can be performed in a short time, because a metal film of copper etc., is stabilized continuously, after the metal film has been formed on a substrate in a film formation step.

The substrate heat-treating device is used for stabilizing the metallic film, after the film is formed on the substrate 3, and the device is provided with a substrate-holding head 4 which holds the substrate 3, a substrate support base 7 positioned to face the head 4, and a heating means which heats the metal film formed on the substrate 3. While the substrate 3 being held by the substrate-holding head 4 is brought into contact with the substrate support base 7, the metal film of the substrate 3 is heat-treated, by heating the film with the frictional heat generated between the substrate 3 and a polishing pad 1, due to the relative motion between the substrate 3 and substrate support base 7.