Title:
DEVICE AND METHOD OF HEATING FOR CAP SOLDERING TO CERAMIC SUBSTRATE
Document Type and Number:
Japanese Patent JPH11260946
Kind Code:
A
Abstract:
To obtain the soldering heater, which can secure the stabilized wettability of solder.
In the soldering heater which solders a cap to a ceramic substrate 1 with solder, a heater 4 which heats the solder as a whole, a heating torch 5 which locally heats the solder, and a sliding voltmeter 8 which is connected to the heating torch 5 and controls the heating torch 5, are provided. The heating torch 5 is provided as the auxiliary device for the soldering and heating. The heating torch 5 has a coil heater 7 for heating nitrogen and a quartz glass pipe 6 containing the coil heater 7. The heating means heats and assists the heater and secures the stabilized wettability of the solder.
Inventors:
SATO YASUHIKO
Application Number:
JP6130098A
Publication Date:
September 24, 1999
Filing Date:
March 12, 1998
Export Citation:
Assignee:
NEC CORP
International Classes:
B23K1/19; B23K31/02; H01L23/02; H01L23/04; H01L23/08; (IPC1-7): H01L23/02; B23K1/19; B23K31/02; H01L23/04; H01L23/08
Attorney, Agent or Firm:
Yoshiyuki Iwasa