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Title:
DEVICE AND METHOD FOR HIGH-FREQUENCY SOLDERING
Document Type and Number:
Japanese Patent JP2009262217
Kind Code:
A
Abstract:

To provide a device for high-frequency soldering aluminum members by which a reliable soldered product can be manufactured by using a radiation thermometer.

A control device 5 performs a first computation work of obtaining the temperature difference between the measurement temperature and the computation starting temperature, and the integrated value of adding the unit time of each temperature difference during the elapsed time from the base time to the present time every time when the unit is elapsed from the base time including the computation starting time set based on the specification of a radiation thermometer 4, a second computation work of obtaining the gradient of the linear function for adding the unit time with the base time as a starting point by dividing the integrated value by the elapsed time, a third computation work of obtaining the set temperature reach estimation time for reaching the soldering set time by the linear function using the gradient, and a fourth computation work of successively repeating the first to third computation works. The control device also has the power stop command signal transmitting function of stopping the power supply to a high frequency heating coil 2 after the post-heating for the predetermined time when the heating time from the base time reaches the preset temperature reach estimation time.


Inventors:
ISHIDA KAZUTAKA
ISHIDA HIDEO
IWATA FUTOSHI
Application Number:
JP2008117323A
Publication Date:
November 12, 2009
Filing Date:
April 28, 2008
Export Citation:
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Assignee:
DAISHIN KOGYO KENKYUSHO KK
NICHIRIN CO LTD
SUNRISE KOGYO KK
International Classes:
B23K3/04; B23K1/00; B23K1/002; B23K1/19; B23K103/10
Domestic Patent References:
JPS61235065A1986-10-20
JP2007317891A2007-12-06
JP2004351503A2004-12-16
JPH09234531A1997-09-09
JP2002239717A2002-08-28
Attorney, Agent or Firm:
Yoshiyuki Kaji