Title:
DEVICE AND METHOD FOR INSPECTING SOLDER BALL
Document Type and Number:
Japanese Patent JP3727276
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make a device and method for inspecting solder balls, by which a semiconductor device containing formed solder balls 21 can be inspected of the solder balls 21 bonded to lands 22 applicable to an in-line system using a simple method.
SOLUTION: After each solder ball 21 is heated to a prescribed temperature by bringing a heating bar 1 into contact with the ball 21, the bar 1 is made to retreat from the ball 1 and the decreasing temperature of the ball 21 is measured by means of a temperature sensor 2 after the ball 21 is left as it is, for a prescribed period of time. Based on the decreasing temperature, the quality of the bonded state of the solder ball 21 to a land 22 is determined. Namely, when the temperature is higher than the reference temperature, the bonded state of the solder ball 21 is determined as defective.
Inventors:
Naoto Kimura
Application Number:
JP2002049485A
Publication Date:
December 14, 2005
Filing Date:
February 26, 2002
Export Citation:
Assignee:
NEC Electronics Corporation
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP2001267349A | ||||
| JP9064046A | ||||
| JP6137825A |
Attorney, Agent or Firm:
Tatsuo Tokumaru
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