To provide a laser beam machining device with which an influence of a thermal deformation upon an optical medium is decreased and a decrease in throughput is not caused.
A laser light source 1 emits a pulse laser beam at an input of an external trigger signal. A movable stage 20 holds and moves a workpiece on the holding plane of the stage. A beam scanning mechanism 10 makes the pulse laser beam emitted from the laser light source l incident upon the surface to be machined of the workpiece 40 held on the movable stage 20, and moves the position of incident points in a certain extent. A controlling mechanism 30 outputs the trigger signals to the laser light source at a certain time interval during the time period in which the beam scanning mechanism 10 is so controlled that the workpiece 40 held on the movable stage 20 is not irradiated with the pulse laser beam.
KAWANA JUN
SHUDO KAZUMASA
TANAKA KENTA
SUMITOMO HEAVY INDUSTRIES