To machine both front and rear surfaces of an object to be machined in a short period of time with one laser oscillator, while improving utilization efficiency of energy, and promoting productivity by increasing a machining speed, in a laser beam machining applied to manufacture of chip resistors or the like.
A desired harmonic wave (for example, a fourfold wave) is emitted by wavelength-converting a basic wave (1,064 nm wavelength) oscillated by the laser oscillator 5a, by the necessary number of times with a wavelength-converting element 5b, and the object 4 is irradiated with the harmonic wave on its front surface to be machined. The object 4 is further irradiated on its rear surface with a low harmonic wave (for example, a double wave) or the basic wave emitted simultaneously in the wavelength conversion process. Consequently, not only the desired harmonic wave but the low harmonic wave and the basic wave are utilized for machining the object 4. Additionally, output decrease due to higher-order- conversion of the harmonic wave is compensated thereby to perform fine machining without decreasing the machining speed.
HIGANO SATORU
TOYAMA SUGURU
KAMAYA ELECTRIC
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