Title:
DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2003142518
Kind Code:
A
Abstract:
To provide a device and method for manufacturing a semiconductor by which a highly versatile semiconductor device can be manufactured, and to provide a semiconductor device.
The semiconductor manufacturing device is provided with a holder which holds a substrate having bonding pads on both surfaces by attachably/detachably sandwiching the substrate, a bonding tool which connects by a wire a first bonding pad provided on one surface of the substrate and a second bonding pad provided on the other surface of the substrate, and a bonding head which is fitted with the bonding tool and rotationally drives the bonding tool around a vertical axis passing the axial center of the bonding tool by driving the tool in three-dimensional directions.
Inventors:
SENBA NAOHARU
SOEJIMA KOJI
SOEJIMA KOJI
Application Number:
JP2001337917A
Publication Date:
May 16, 2003
Filing Date:
November 02, 2001
Export Citation:
Assignee:
NEC ELECTRONICS CORP
International Classes:
H01L21/00; H01L21/60; H01L23/52; H01L25/065; H01L25/07; H01L25/18; H01L23/12; (IPC1-7): H01L21/60; H01L23/12; H01L23/52; H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Asato Kato