PURPOSE: To provide a device and method for mounting an electronic component for excellently mounting the electronic component on a board without necessitating compensating operation.
CONSTITUTION: The top plane outline image 15 of a bare IC component is picked up by a first image pick up camera 12 through a transparent head 10 that supports the bare IC component 2, the bottom plane outline image 16 of the IC component 2 including the electrode part 2a is picked up by a second image pick up camera 14, and the relative position of the electrode part 2a to the top plane outline image 15 is recognized. The positioning point for the board and the top plane outline image 15 of the bare IC component 2 are picked up by the first image pick up device, the position of the electrode corresponding part on the board is calculated from the positioning point, and the position of the electrode part 2a of the bare IC component 2 is calculated from the top plane outline image 15 of the bare IC component 2. The electronic component is mounted by moving the transparent head 10 and the board 1 so as to meet the position data with each other.
MATSUO TAKAHIRO
KADORIKU SHINJI
SUGIMURA TOSHIAKI
