Title:
DEVICE AND METHOD FOR MOUNTING ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP3750433
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a device and a method for mounting electronic parts where wasteful time is excluded and unit process time is reduced.
SOLUTION: The device for mounting electronic parts on a substrate 3 by picking them up from supply parts 4a and 4b for supplying the electronic parts using a plurality of transfer heads 8A and 8B is equipped with tentative installation stages 10A and 10B for receiving electronic parts from each transfer head and tentatively installing them and performs next mounted parts preparation operation for picking up the next electronic parts for mounting from a supply part by one transfer head concerned and tentatively mounting them on the tentative installation stages 8A and 8B when a mounting operation for mounting the electronic parts to the substrate by one transfer head is completed faster than the mounting operation by the other transfer head, thus effectively utilizing the standby time of the transfer head where the mounting operation has been completed and reducing entire tact time.
Inventors:
Kazuhide Nagao
Yasuhiro Kashiwagi
Yasuhiro Kashiwagi
Application Number:
JP23933699A
Publication Date:
March 01, 2006
Filing Date:
August 26, 1999
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Domestic Patent References:
| JP3218097A | ||||
| JP61265223A | ||||
| JP2084000A | ||||
| JP9293991A | ||||
| JP9283985A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano