Title:
DEVICE AND METHOD FOR MOUNTING SOLDER BALL
Document Type and Number:
Japanese Patent JP2828104
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a device and method for mounting solder balls by which whether or not the solder balls picked up by means of a pickup head have been accurately mounted on a work without mistakes can be discriminated easily.
SOLUTION: A solder ball mounting device which mounts solder balls provided in a supplying section on a work by picking up the solder balls by vacuum chuck with a plurality of vacuum holes 64 formed on the lower surface of a pickup head 11 is provided with the pickup head 11, constituted of a black box, a nozzle 65 which emits light from a light source 67 and is provided in the black box, and a photoreceptor which receives light leaking out of the black box through the holes 64. The presence/absence of mis-mounting of solder balls can be discriminated by emitting light from the light source 67, while the pickup head 11 returns to the supplying section after the head 11 mounts the solder balls on the work and receives the light leaking out of the black box through the holes 64.
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Inventors:
Noda, Kazuhiro
Nakazato, Shinichi
Nakazato, Shinichi
Application Number:
JP1998000140908
Publication Date:
September 18, 1998
Filing Date:
May 22, 1998
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/60; H01L21/321; H05K3/34; H05K13/08; (IPC1-7): H01L21/60