Title:
DEVICE AND METHOD FOR PLATING SUBSTRATE
Document Type and Number:
Japanese Patent JP3547336
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To rapidly and uniformly achieve an electroplating on a substrate.
SOLUTION: After an electroplating solution Q is filled in a plating reaction tank 12 comprising a substrate holding mechanism 1 and an upper cup 10, the substrate holding mechanism 1 and the upper cup 10 are separated from each other by a specified space to form a gap 80 to discharge the electroplating solution Q around a substrate W held by the substrate holding mechanism 1 while continuously feeding the electroplating solution Q to the plating reaction tank 12, and the electroplating in an energized condition between an anode 14 and a cathode is performed while rotating the mechanism 1.
Inventors:
Sadao Hirae
Yusuke Muraoka
Hiromi Murayama
Yusuke Muraoka
Hiromi Murayama
Application Number:
JP6437199A
Publication Date:
July 28, 2004
Filing Date:
March 11, 1999
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
C25D7/00; C25D7/12; C25D17/00; C25D21/08; C25D21/10; (IPC1-7): C25D17/00; C25D7/00; C25D7/12; C25D21/08; C25D21/10
Domestic Patent References:
| JP2001514332A |
Attorney, Agent or Firm:
Tsutomu Sugiya