To provide a device and a method for polishing, capable of providing uniform surface finishing without reducing workability or bringing about inconveniences such as increased facility costs.

A buff polisher 1 is provided with a pedestal and a turn table 3, and buff cloth B is attached on the turn table 3. A sample 11 is set in the through-hole 12 of a sample holder 6, the leg part 16 of a weight 15 is inserted into insertion holes 13 and 14, and the weight 15 is supported on a weight holder 8 or the like so as not to be tilted. At the same time, the tip part of the leg part 16 of the weight 15 is engaged in the recessed part 11a of the sample 11. The turn table 3 is rotated by a specified rotational speed, and abrasives are periodically supplied to the center part of buff cloth B. A friction force is generated between the buff cloth B and surface of the sample 11 to be polished, and thus the surface to be polished is polished by the buff cloth B. At this time, since the friction force varies from portion to portion in the polished surface of the sample 11, the sample 11 is rotated around a pressing portion.