To provide a device and a method for polishing, capable of preventing the damage to the polished surface of an article to be polished caused by falling abrasive grains.

A polishing device is provided with a pad 32 fixed to the upper surface of a surface plate 30 rotary-driven around an axis, a polishing head 36 disposed above the pad 32 in a position eccentric from the axis of the surface plate 30 and holding an article 12 to be polished by an abrasive material 16 with a pad surface 32a on the lower surface side, a polishing head rotating lifting means 46 for rotating/lifting the polishing head 36 to press the article 12 to be polished to the pad surface 32a, and a pad surface smoothing means 50 made eccentric from the axis of the surface plate 30, disposed above the pad surface 32a in a position different from the polishing head 36, and capable of smoothing the roughness of the pad surface 32a using very super-acoustic wave vibration in a non-contact state.