Title:
DEVICE AND METHOD FOR POLISHING
Document Type and Number:
Japanese Patent JP3812970
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make a polishing pad easily attachable to a polishing bottom plate by installing a holding plate holding the center and outer edge part of this polishing pad respectively, while pulling plural spots of this pad outer edge holding plate, and likewise installing a stretching and framing means, making tension act on this polishing pad and letting this pad adhere to the polishing bottom plate, as well.
SOLUTION: At a time when a polishing pad 11 is stretched on a polishing bottom plate 31, first of all, a pad center holding plate 14 and a pad outer edge holding plate 20 both are attached to this polishing pad 11 with bolts. At this time, this pad center holding plate 14 is attached to a central recess 32 of the polishing bottom plate 31, while each hook 21 of the pad outer edge holding plate 20 is hitched on each hook 22 at tips of rods 23 of air cylinders 25. Then these air cylinders 25 are driven and the pad outer edge holding plate 20 is pulled at constant tension upward, stretching the polishing pad 11 on the polishing bottom plate 31. In addition, the pad center holding plate 14 is rotated at the specified angle, thereby overhanging it to the outside of the pad center holding upper plate 13 and thereby this projecting part 13b is attached so as to make it engaged with a groove 31b of a polishing surface plate 31.
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Inventors:
Takashi Omura
Katsufumi Goto
Katsufumi Goto
Application Number:
JP15939096A
Publication Date:
August 23, 2006
Filing Date:
June 20, 1996
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B37/20; B24B37/26; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Domestic Patent References:
| JP7052033A | ||||
| JP3093064U | ||||
| JP5093183A |
Attorney, Agent or Firm:
Nobuo Kono