Title:
DEVICE AND METHOD FOR PRESSURE-BONDING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3949462
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure-bonding device which can prevent the breakage of a board and also can pressure-bond electronic components satisfactorily.
SOLUTION: This device is for arranging a plurality of electronic components 2 in a straight line and mounting them on a board 1, and this is equipped with a pressurizing tool 26, a pressure receiving tool 29 provided facing opposite to this pressurizing tool, a board supporting tool 31 for supporting the board 1, a shifter 32, and a controller 25 for controlling this shifter thereby pressure- bonding the substrate and the electronic components to each other by the pressurizing tool, and this controller regulates the relative position between the pressurizing tool and the board supported by the board-supporting tool, so that an end of the pressurizing tool is positioned outside that one row of the electronic components or between adjoining electronic components by controlling the displacement device.
Inventors:
Ogawa Koji
Shinichi Ogimoto
Kunihiro Iwanaga
Shinichi Ogimoto
Kunihiro Iwanaga
Application Number:
JP2002024869A
Publication Date:
July 25, 2007
Filing Date:
January 31, 2002
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
H01L21/60; H05K3/32; (IPC1-7): H01L21/60; H05K3/32
Domestic Patent References:
| JP10289929A | ||||
| JP2002313852A |