Title:
DEVICE FOR AND METHOD OF STICKING TAPE
Document Type and Number:
Japanese Patent JP2015224300
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a tape sticking device for sticking a masking tape serving the protection of a peripheral part in the substrate of a wafer or the like.SOLUTION: There is provided a tape sticking device comprising a substrate holding part 1 holding and rotating a substrate W, and a tape sticking unit 8 sticking a masking tape 7 on the peripheral part of the substrate W held by the substrate holding part 1. The tape sticking unit includes: a side roller 23 pressing the masking tape 7 on the outer peripheral side of the substrate W; a first roller 26 which folds the masking tape 7 pressed on the outer peripheral side of the substrate W along the longitudinal direction of the masking tape and sticks the folded portion of the tape 7 on the upper face of the peripheral part of the substrate W; and a second roller 27 which folds the masking tape 7 pressed on the outer peripheral side of the substrate W along the longitudinal direction of the tape and sticks the folded portion of the tape 7 on the lower face of the peripheral part of the substrate W.
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Inventors:
ITO KENYA
UCHIYAMA KEISUKE
MATSUI TOMIICHI
SHIBUYA MASATO
UCHIYAMA KEISUKE
MATSUI TOMIICHI
SHIBUYA MASATO
Application Number:
JP2014110515A
Publication Date:
December 14, 2015
Filing Date:
May 28, 2014
Export Citation:
Assignee:
EBARA CORP
IS ENGINEERING KK
IS ENGINEERING KK
International Classes:
C09J7/02; B65H35/07; B65H37/04; B65H37/06; B65H41/00
Domestic Patent References:
| JP2012069782A | 2012-04-05 | |||
| JPH0253883A | 1990-02-22 | |||
| JP3012931U | 1995-06-27 | |||
| JPH0738171U | 1995-07-14 | |||
| JP4974094B1 | 2012-07-11 | |||
| JP2002026218A | 2002-01-25 | |||
| JPS59167452A | 1984-09-20 | |||
| JPS5838774A | 1983-03-07 | |||
| JP2007253825A | 2007-10-04 | |||
| JPH06211410A | 1994-08-02 |
Attorney, Agent or Firm:
Isamu Watanabe
Tetsuya Hirosawa
Tetsuya Hirosawa