DEVICE FOR MUTUALLY CONNECTING BETWEEN CELLS OF PREPLANTED ULTRASONIC WAVE INTEGRATED CIRCUIT

Title:

DEVICE FOR MUTUALLY CONNECTING BETWEEN CELLS OF PREPLANTED ULTRASONIC WAVE INTEGRATED CIRCUIT

Document Type and Number:

Japanese Patent JPS6053053

Kind Code:

A

Abstract:

1. Interconnection device between the cells of an integrated hyperfrequency circuit pre-implanted in a semiconductor material (11), the cells being formed of active and passive components comprising metallizations on the upper surface of the semiconductor material chip, this interconnection device being characterized in that the coupling between a component (T1) of a first cell and a component (T2) of a second cell is capacitive, and in that it is embodied by : - at least one microstrip (6) in ohmic contact with a metallization (3) of the first component (T1) and at least one microstrip (5') in ohmic contact with a metallization (2') of the second component (T2), said microstrips being carried by the upper surface of the semiconductor material, - at least one insulating layer (12) deposited on the upper surface of the semiconductor material (11) and on the microstrips (5', 6) carried thereby, - at least one microstrip (9) carried by the insulating layer (12), said microstrip partially covering the microstrips (5', 6) carried by the semiconductor material (11) to form a capacitive connection.

Inventors:

JIYON MAGARUSHIYATSUKU

Application Number:

JP15648184A

Publication Date:

March 26, 1985

Filing Date:

July 26, 1984

Export Citation:

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