To provide a polishing device for the end face of a substrate increased in reliability by taking the depth of the worn groove of a polishing wheel in a correction element and adaptably controlled and a method for determining the acceptance or rejection of the polishing of the substrate.
This polishing device includes the polishing wheel for polishing the end face of the substrate, a rotatingly driving means for the polishing wheel, and a slitting and feeding means for the polishing wheel. The rotatingly driving means for the polishing wheel includes a load current detection means for detecting by the contact of the end face of the substrate and a correction means for a load current produced when the side surface of the worn groove produced in the polishing wheel is brought into contact with the substrate.
YAMAGISHI SOJI
IGAI OSAMU
MATSUOKA YUTAKA
ISE HIRONORI
AVANSTRATE INC
| JPH11320364A | 1999-11-24 | |||
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| JPH11320364A | 1999-11-24 |