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Patent Searching and Data


Title:
DEVICE FOR RECEIVING CHIP-LIKE CARRIER AND METHOD OF ASSEMBLING PLURAL SAME DEVICES
Document Type and Number:
Japanese Patent JP2003130876
Kind Code:
A
Abstract:

To provide a device for receiving the chip-like carrier, and a method of assembling a plurality of such devices.

This device comprises an opening for receiving the liquid sample, a cartridge including a casing part 14, the casing part having a means accessable to an inner surface 17, an outer surface 16, and an active face of the chip-like carrier 21, and a sealing material capable of being reversely liquefied at least once, shapes and dimensions of a first cavity 18, the chip-like carrier and the sealing material 26 are determined to insert the chip-like carrier into a space defined by the sealing material. In a liquid condition, the sealing material seals a clearance between a side wall 24 of the first cavity and the carrier, and the solidified sealing material provides strong and watertight bond.


Inventors:
VISCHER PETER
Application Number:
JP2002219013A
Publication Date:
May 08, 2003
Filing Date:
July 29, 2002
Export Citation:
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Assignee:
HOFFMANN LA ROCHE
International Classes:
B01L3/00; B01L9/00; G01N33/53; G01N21/64; G01N37/00; H01L21/00; C40B40/06; (IPC1-7): G01N33/53; G01N37/00
Attorney, Agent or Firm:
Akira Asamura (3 outside)