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Title:
DEVICE FOR SEALING TOOL FOR FRACTURE OF OBJECT TO BE FRACTURED
Document Type and Number:
Japanese Patent JP3818701
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To improve fracture efficiency by a method wherein a tool for fracture moved toward a mounting hole, formed in an object to be fractured, by a moving member is pressed in the direction of depth by a moving press device.
SOLUTION: A cylindrical body 26 in which a fracture probe 1A is incorporated is disposed with an expansion part 37 brought into contact with the periphery of the opening part of a mounting hole 20a. Air 45 for movement is then fed to move a piston member 36, the probe 1A is pressed by a forced plate 32 and mounted in the hole 20a. Electric energy is fed to a metal fine wire in the probe 1A in a short time from the capacitor of an energy feeding device at the outside and rapidly molten and vaporized. A material for fracture, such as water, with which the probe 1A is filled is rapidly vaporized to fracture the object H1 to be fractured. In this case, since at the opening part of the hole 20a, the probe 1A is pressed in the direction of depth by the forced plate 32, an impact pressure through the opening part of the hole 20a is prevented from escape, the object H1 to be fractured is reliable fractured, and further the generation of noise during fracture is reduced.


Inventors:
Tetsuro Mori
Naoya Yoshioka
Kyozo Suyama
Hironari Arai
Tetsuya Inoue
Hidehiko Maebata
Shoji Nishida
Application Number:
JP22193196A
Publication Date:
September 06, 2006
Filing Date:
August 23, 1996
Export Citation:
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Assignee:
Obayashi Corporation
Hitachi Zosen Corporation
International Classes:
E04G23/08; E21C37/18; E21C37/06; (IPC1-7): E04G23/08; E21C37/06
Domestic Patent References:
JP62174496A
JP60031839A
JP62085594U
Attorney, Agent or Firm:
Yoshihiro Morimoto